Capabilities
Hybrid Chip and Wire on Ceramic
For more than 28 years our 180,000 ft2 hybrid micro-circuit facility located in Mansfield Massachusetts has been producing Mil-certified Data Acquisition components. These hermetically-sealed components are assembled in our class 100,000 clean-room on thick-film substrates manufactured at this same location. All Hi-Rel products are fully tested over their extended operating temperature range.
Chip - Wire and SMT on FR4
In order to provide the smallest packages at the lowest cost we have introduced a new form of Hybrid that incorporates chip-wire and SMT technology on FR4. These products are housed in our new Mini SMT Quad-Pak or traditional TDIP
Surface Mount Technology (SMT)
Commercial products that do not require hermetically sealed packaging can be manufactured using SMT technology to provide the same fully functional performance at a significantly lower cost.
- Auto Pick and Place
- Manual Pick and Place
- AOI inspection
- Lot control verification
- Auto Pin Insertion
- High Temp Solder assembly
- ROHS or non ROHS compliant assemblies
- Through-hole assembly
- Flying Leads
- Encapsulation
Thick Film
Hermetically sealed products manufactured in our Class 100,000 clean room are assembled on thick-film substrates manufactured in this same facility.
Test & Environmental
All products, whether built using chip-wire, chip-wire and SMT, or solely SMT technology, are fully tested to their specified static and dynamic parameters; Hi-Rel devices are fully tested under their specified extended temperature range.
An MES tracking system is used to monitor each step of the manufacturing process as well as to record all test results by device serial number. Lot control and traceability is provided for all commercial and Hi-Rel Data acquisition products.
Facility Quality Standards
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